濺射鍍膜機和熱蒸鍍儀

磁控濺射鍍膜機 DST3-T 配備了一個大腔體（直徑 300 mm）和三個直徑2”的水冷陰極，適合長時間沉積。磁控濺射鍍膜機配有射頻和直流電源。它可以濺射半導體、電介質和金屬（氧化性和惰性）靶材。

濺射鍍膜機系統配備了一個自動調節匹配器，可將射頻濺射過程中的反射功率降至最低。為了增加薄膜與基底的附著力並改善薄膜結構，可在基底上施加 300 V 直流偏置電壓（可選）

• DST3 – TA (帶角度陰極):
  DST3-TA 配備了三個具有共同中心點的角度陰極。濺射鍍膜機系統可同時或單獨從兩個或三個（可選）靶材上進行濺射，以分別形成合金或多層沉積。該模型中基板的最大尺寸可以是 3 英寸。

• 緊湊系統中的濺射和熱蒸鍍的完美工藝。
• 高真空級別。
• 配備適用於金屬、半導體和電介質的直流和射頻電源。
• 帶三個2”水冷角度磁控陰極，適用於生產合金薄膜 (DST3-TA) 和多層沉積。
• 帶熱源裝置。
• 兩個固定和可移動的石英晶體監測系統，用於即時厚度測量（1 nm精度）。
• 兩個精密質量流控制器，用於良好控制氬氣流量和反應性濺射氣體。
• 手動或自動定時或定厚沉積。
• 提供GLAD (Glancing Angle Deposition) 濺鍍技術。
• 等離子清洗。
• 視覺式的觸控螢幕，可控制濺鍍過程並快速輸入數據。
• 友善的用戶軟體介面，並可通過網路更新。
• Vac coat 產品在全球範圍內都有公共和產品責任保險，以防 Vac coat 系統造成任何財產損失或人身傷害。
• 可翻轉和改變旋轉樣品架的高度，並可選擇陰極。
• 500°C基板加熱器（可選）。
• 300 V DC 基板偏置電壓（可選）。
• 無限沉積時間，不會破壞真空。

• 金屬、半導體和介質薄膜。
• 奈米和微電子。
• 太陽能電池應用。
• 共濺鍍工藝。
• 光學元件鍍膜。
• 薄膜傳感器。
• 磁性薄膜設備。
• 電腦記憶體應用。
• 用於 SEM 和 FE-SEM 樣品製備的細顆粒結構沉積。

Options and Accessories

The Triple Target Turbomolecular Pumped Sputter Coater – DST3-T has the following options and accessories:

• Quartz crystal sensors
• Spare vacuum glass chamber
• Sputtering Targets
• Thermal source materials
• 300V DC bias voltage
• Plasma cleaner
• 500˚C substrate heater

The DST3-T, Magnetron Desk Sputter Coater, is equipped with a large chamber (300 mm diameter) and three 2” diameter water-cooled cathodes which make it suitable for long time deposition. The magnetron desk sputter coater is equipped with RF and DC power supplies. It can sputter semiconductors, dielectrics and metal (oxidizing & noble) targets.

The sputter coater system is equipped with an auto adjustable matching box, minimizing the reflected power in the RF sputtering process. For increasing film adhesion to the substrate and to improve the film structures, a 300 V, DC bias voltage can be applied to the substrate (optional).

• DST3 – TA (Angled Cathodes):
  The DST3-TA is equipped with three angled cathodes with a common focal point. The sputter coater system can sputter from two or three (optional) targets simultaneously or independently to form alloys or multilayer deposition respectively. The maximum size of substrates in this model could be 3 inches.

• Sputtering and Thermal Evaporation process in a compact system
• High vacuum level
• Equipped with DC and RF power supplies suitable for metals, semiconductors and dielectrics
• Three 2” water-cooled angled, magnetron cathodes suitable for producing alloy films (DST3-TA) and multilayer deposition
• One thermal source installation
• Two fixed and movable quartz crystal monitoring system for real time thickness measurement (1 nm precision)
• Two MFCs
• Manual or automatic Timed or Thickness deposition
• GLAD Sputtering
• Plasma Cleaning
• Intuitive touch screen to control coating process and rapid data input
• User friendly software that can be updated via network
• Vac coat Products are covered worldwide by both public and product Liability Insurance in case any property damage or personal injury happens caused by the Vac Coat systems.
• Tillable and change height of rotary sample holder with ability to selection of the cathodes
• 500 °C substrate heater (optional)
• 300 V DC substrate bias voltages (optional)
• Unlimited deposition time without breaking vacuum

• Metal, Semiconductor, and Dielectric Films
• Nano & Microelectronic
• Solar cell applications
• Co-Sputtering processes
• Optical components coating
• Thin film sensors
• Magnetic thin film devices
• Computer memory applications
• Fine grain structural deposition for SEM  &  FE-SEM sample preparation

Options and Accessories

The Triple Target Turbomolecular Pumped Sputter Coater – DST3-T has the following options and accessories:

• Quartz crystal sensors
• Spare vacuum glass chamber
• Sputtering Targets
• Thermal source materials
• 300V DC bias voltage
• Plasma cleaner
• 500˚C substrate heater