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無鈹 ( Beryllium ) X 射線視窗

Beryllium Free X-Ray Windows 型號:B4C
Amptek 宣佈推出碳化硼 (B4C) 用於 Amptek 的 FAST SDD® 和 SiPIN 探測器的視窗。該產品是多年努力的結果,旨在為最終使用者和 OEM 製造商提供標準鈹 (Be) 箔的高性能視窗替代品。
  • Amptek 宣佈推出碳化硼 (B4C) 用於 Amptek 的 FAST SDD® 和 SiPIN 探測器的視窗。該產品是多年努力的結果,旨在為最終使用者和 OEM 製造商提供標準鈹 (Be) 箔的高性能視窗替代品。 


    產品優勢

    • 在廣泛的能量範圍內,傳送效率與 Be 箔相當,典型用於手持式和桌上型 XRF 應用。
      • 從鈹視窗切換到 B4C 視窗時,儀器的結果不會受到太大影響。
      • 可用於以前使用過鈹視窗的大多數應用。   
    • 所]使用是無毒材料讓您在安裝和使用過程中無後顧之憂。
      • 對鈹的潛在健康危害和接觸鈹的擔憂對這些視窗來說不是問題。
    • 與典型的鈹箔相比,厚度變化更小。
      • 鈹視窗成型製程允許視窗厚度有有一定程度的變化。 然,B4C 視窗的半導體製造過程受到嚴格控制,因此視窗厚度更加一致。
      • 原始設備製造商更喜歡這種方式,因為即使在較低的能量下,他們也能期望探測器與探測器之間有相同的傳送效率。
      • 如果視窗厚度更接近標示值,則可在定量計算中更好地建模。


    產品應用

    B4C 視窗的穿透率可與標準的 ⅓ mil ( 密耳 ) 和 ½ mil  ( 密耳 )的Be 視窗媲美。 最初發布的產品採用厚度為 3.5 µm 的均勻B4C 層,自支撐,無需底層網格。 鋁質外塗層提供接地表面,幫助探測器屏蔽電磁干擾。


    一致的厚度

     

  •   新型碳化硼
    B4C
    與標準 Be 視窗相比
    1/3 mil Be ½ mil Be
    厚度 3.5 µm 7.6 µm
    .0003”
    12.7 µm
    .0005”
    容許偏差 (-.3/+.3 µm) (-.0 µm/+5.1 µm)
    (-.0000”/+.0002”)
    (-.0 µm/+5.1 µm)
    (-.0000”/+.0002”)
    直徑 7 mm 7 mm
    接地 ? Yes ( 鍍鋁 )    
    其它塗層 None Yes ( 聚對二甲苯 )
    氦洩漏率 ??? ???
    工作溫度 -35 °C to +80° C -35 °C to +80° C
    堅固性 4 英尺跌落測試中 80% 的存活率  
  • Amptek is announcing the introduction of Boron Carbide (B4C) windows for use with Amptek’s FAST SDD® and SiPIN detectors. The product offering is the result of a multi-year effort to provide end-users and OEM manufacturers with a high-performance window alternative to standard beryllium (Be) foils. 
     

    Advantages

    • Comparable transmission efficiency to Be foils over a wide energy range, typical to hand-held and benchtop XRF applications
      • Results from an instrument will not be greatly affected when switching from Beryllium to B4C windows.
      • Can be used in most places where a beryllium window was previously used. 
    • Non-toxic material provides worry-free handling during installation and use
      • Concerns over the potential health hazards of beryllium and exposure are not an issue with these windows. 
    • Less thickness variation as compared to typical Be foils
      • The beryllium window forming process allows a fair amount of variation in window thickness.  The tightly controlled semiconductor fabrication process on the B4C windows produces a much more consistent window thickness.  
      • OEM's prefer this as they can expect similar transmission from detector to detector, even at lower energies.  
      • Allows for better modeling in quantitative calculations if the window thickness more closely matches the nominal values.
         


    Applications

    B4C windows have been designed to provide transmissions comparable to standard ⅓ mil and ½ mil Be windows.  The initial product release utilizes a uniform 3.5 µm thick B4C layer, self-supported, without the need for an underlying grid.  An aluminum outer coating provides a grounded surface to help shield the detector from EMI. 


    Consistent Thickness ​

     

  •  

    New Boron Carbide

    B4C
    compared to standard Be windows
    1/3 mil Be ½ mil Be
    Thickness 3.5 µm 7.6 µm
    .0003”
    12.7 µm
    .0005”
    Tolerance (-.3/+.3 µm) (-.0 µm/+5.1 µm)
    (-.0000”/+.0002”)
    (-.0 µm/+5.1 µm)
    (-.0000”/+.0002”)
    Diameter 7 mm 7 mm
    Grounded? Yes ( Al coated )    
    Additional coatings None Yes ( Parylene )
    He Leak Rate ??? ???
    Operating Temperature -35 °C to +80° C -35 °C to +80° C
    Ruggedness 80% survival from 4ft. drop test